Magnetron Sputter System with 4x6

Optical device
Passivation layer
Constantan materials

Special Features

4x6" sputter system for R&D and small scale production.
Excellent thickness uniformity(below +-2.8% for the layer of 228.6 nm in thickness).
Highly smooth surface(RMS roughness of deposited layer: 25 Å).
RF/DC magnetron sputter.
Automatic loading system.
Average throughput Up to 100,000 wafers per year.

Specifications

Wafer capacity : 20 x 4"
Dimension : 1575L X 1269H X 930W (mm3)
Power: AC 1.2kW for sputter source
           AC 600W for substrate bias voltage(13.56MHz)
Gas : Ar / O2 / H2
Pump : rotary(980l/min) & turbo(1000l/s)