Company Introduction

Developed itmes

- Ion beam source
- Arc source
- Filtered cathodic vacuum arc system and process
- LPCVD for nanotube synthesis
- Silica PECVD system
- UHV(Ultra High Vacuum) sputtering system
- Silica TCP (Transformer Coupled Plasma) etcher
- UHV-sputter system for ferromagnetic multilayers
- Vacuum arc system for nitrides deposition
- In-line system of vacuum arc deposition for protecting PDP
electrodes
- High vacuum test system for a flat light source evaluation
- Multifunctional standard sputtering system for R&D
- NPPN(New Post Plasma Nitriding) System
- Sputter for polygon mirror applicable to laser printer
- Production scale of arc ion plating (AIP) system
- Ion beam sputter for precision optics
- Production scale of AIP and NPPN systems
- Ion plating system for various coloration
- Pilot scale of arc discharge equipment for CNT transparent electrode
sputter web coater for flexible display research
- Sputter system for ophthalmic
- Polycrystalline silicon ingot growing equipment
- PECVD system for anti-reflective coatings on solar cell
- PECVD system for graphene deposition
- Al plasma nitriding equipment for mass production with KAITECH
- Equipment of carbon nanotube using electrical arc discharge method
- Graphene PECVD-PVD Cluster equipment