Standard Magnetron Sputter with 4x3

Metal, ceramic, and alloy deposition for basic research in various fields.

Special Features

Deposition of metallic and inorganic layers is not only available, but partially applicable to organic materials deposition by adopting both rf and dc sources.
Multilayer and codeposition in up or down-sputtering mode can be selectively chosen.
Automatic loadlock system, which is compactly designed for space saving.
Optimized configurations of sputter gun and shutter for minimizing cross-contamination between installed targets.
Typical process data of various materials can be delivered on request.

Specifications

Wafer capacity : 4in wafer or 100mm x 100mm glass
Dimension : 1,720L x 1,835H x 1,080W (mm3)
Power : AC 220V, single or three phase
Gas : Ar/N2/O2
Pump: Rotary pump & turbomolecular pump
Heater : SiC heater 6" (Max. 600'C)
Substrate bias : RF or DC
Loadlock system : single wafer loading or cassette loading
System control : LabView-based PC control